Smartphone chassis
Smartphone internal chassis
Products LEONA™
- TOP
- Application cases
- Next-generation communications
Next-generation communications
・Communication base station antenna cover
・Base materialof MID
Covers for various communication antennas and base materials for MID antennas
Products XYRON™
・Communication base station antenna cover
・Base materialof MID
Covers for various communication antennas and base materials for MID antennas
Products
Grades
442Z、Development grade
・Non-reinforced flame-retardant grades
Features
・The excellent dielectric performance (low dielectric constant, low dissipation factor, and their small temperature dependence) make our materials suitable for using as antenna cover.
・There is a lineup of grades with various dielectric performances such as high dielectric constant development materials.
・Good impact resistance and stable long-term physical properties.
PIM : Powder Injection Molding
PIM is a method of manufacturing small, high-precision metal and ceramic parts by adding a binder to...
Products TENAC™
PIM : Powder Injection Molding
PIM is a method of manufacturing small, high-precision metal and ceramic parts by adding a binder to metal or ceramic powder and injection molding, followed by degreasing and sintering.
Products
Grades
・Super high flowability grades: Tenac™ FF520, Tenac™ 9520
・We have developed innovative polyacetal resins to utilize as a binder.
・It is available to markets as a Super high flowability grade.
Features
・Excellent extrudability and thermal stability of metal or ceramic powder and binder mixtures (feedstock)
・Excellent feedstock formability
・Excellent strength of feedstock molding