Next-generation communications

Smartphone chassis

Smartphone internal chassis

Products

LEONA™

Grades

SG105
A grade that combines high stiffness, good appearance, and easy molding.

Features

・Good appearance
・High stiffness

・Communication base station antenna cover
・Base materialof MID

Covers for various communication antennas and base materials for MID antennas

Products

XYRON™

Grades

442Z、Development grade
・Non-reinforced flame-retardant grades

Features

・The excellent dielectric performance (low dielectric constant, low dissipation factor, and their small temperature dependence) make our materials suitable for using as antenna cover.
・There is a lineup of grades with various dielectric performances such as high dielectric constant development materials.
・Good impact resistance and stable long-term physical properties.

PIM : Powder Injection Molding

PIM is a method of manufacturing small, high-precision metal and ceramic parts by adding a binder to metal or ceramic powder and injection molding, followed by degreasing and sintering.

Powder Injection Molding

Products

TENAC™

Grades

・Super high flowability grades: Tenac™ FF520, Tenac™ 9520
・We have developed innovative polyacetal resins to utilize as a binder.
・It is available to markets as a Super high flowability grade.

Features

・Excellent extrudability and thermal stability of metal or ceramic powder and binder mixtures (feedstock)
・Excellent feedstock formability
・Excellent strength of feedstock molding