Molding conditions

Category Homopolymer
Grades 2010,3010,4010,4012,4050,4060,5010,5050,7010,7050,7054,9054,2013A,3013A,4013A,5013A,FS410,GA510,GA520,
GN705,LA543,LL700,LM511,LP402,LS701,LT200,LT802,LT804,MG210,Z3010,Z4060
Predrying Conditions Temp.(°C) 80~90
Time (hr) 3~4
Molding Conditions Resin temp. (°C) 190~210
Mold temp. (°C) > 60
Note TENAC™ molding conditions

  1. Before handling or using any TENAC polyacetal resin, be sure to consult the relevant Material Safety Data Sheet, available Asahi Kasei Corporation. Polyacetal resins generate gases, principally formaldehyde, during decomposition.
  2. Keep away from flame and heat sources. During a fire, irritating and highly toxic gases (formaldehyde, carbon monoxide, etc.) may be generated by thermal decomposition or combustion.
  3. If resin is spilled on the floor, clean it up immediately to prevent slipping and falling.
  4. Their decomposition in the cylinder of the molding, extruding, or other processing machine may also cause a dangerous high-pressure buildup inside the cylinder. When handling or processing Tenac, the following precautions must be observed.
    1. Avoid resin temperatures and cylinder residence times which may cause resin decomposition. The following limits are a general guide; temperature and residence time may be lower for specific operating conditions.
      – Resin temperature
      Optimum: 190 – 210°C
      Maximum: 230°C
      – Maximum cylinder residence time
      For non-reinforced non-colored resins:
      50 min. at 190°C
      40 min. at 200 °C
      30 min. at 210 °C
      For colored or reinforced resins, consult Asahi Kasei Corporation.
    2. In any case where the cylinder residence time exceeds the relevant limit, promptly purge the cylinder.
    3. At shutdown, purge all resin from the cylinder before turning off the cylinder heater.
    4. As purging material, use only non-colored polyethylene, transparent polystyrene, or Asaclean purging agent from Asahi Kasei; do not use any other resin. Always submerge purged resin in water immediately after purging, to prevent air contamination in the working environment.
    5. Do not mix TENAC with pigments or additives other than those designated by Asahi Kasei, or with different resins or resin grades, as this may degrade the thermal stability of TENAC and lead to decomposition.
    6. Ensure that the cylinder, nozzle, hot runners, and other high temperature zones are free from local resin detention, as this may result in resin burning or decomposition. In the event of such detention, promptly remove all residual resin by complete, thorough purging.
    7. Always provide adequate local or general ventilation to maintain a safe working environment.
  5. The information provided here is accurate to the best of our knowledge, based on all information and data available at this time, and is subject to change without notice. It is provided with no guarantee or assumption of liability whatsoever. It applies only to the normal handling and use of TENAC as a molding material. Any other use or application would necessitate additional, special safety precautions, and is not recommended.

 

Category Copolymer
Grades 3510,3513,4513,4520,4563,5520,7513,7520,8520,9520,CF452,CF454,EF750,EF850,GN455,GN752,GN755,HC350,HC450,
HC460,HC550,HC750,HC760,LD755,LT350,LV450,LX750,LZ750,MT754,NS556,TFC64,TFC77,TFC84,Z3510,Z3513,Z4513,
Z4520,Z4563,ZH450,ZH760,ZLV40,ZM413
Predrying Conditions Temp.(°C) 80~90
Time (hr) 3~4
Molding Conditions Resin temp. (°C) 180~210
Mold temp. (°C) > 60
Note TENAC™-C molding conditions

  1. Before handling or using any TENAC-C polyacetal resin, be sure to consult the relevant Material Safety Data Sheet, available Asahi Kasei Corporation. Polyacetal resins generate gases, principally formaldehyde, during decomposition.
  2. Keep away from flame and heat sources. During a fire, irritating and highly toxic gases (formaldehyde, carbon monoxide, etc.) may be generated by thermal decomposition or combustion.
  3. If resin is spilled on the floor, clean it up immediately to prevent slipping and falling.
  4. Their decomposition in the cylinder of the molding, extruding, or other processing machine may also cause a dangerous high-pressure buildup inside the cylinder. When handling or processing Tenac-C, the following precautions must be observed.
    1. Avoid resin temperatures and cylinder residence times which may cause resin decomposition. The following limits are a general guide; temperature and residence time may be lower for specific operating conditions.
      – Resin temperature
      Optimum: 180 – 210°C
      Maximum: 250°C
      – Maximum cylinder residence time
      For non-reinforced non-colored resins:
      70 min. at 190°C
      60 min. at 200°C
      40 min. at 210°C
      For colored or reinforced resins, consult Asahi Kasei Corporation.
    2. In any case where the cylinder residence time exceeds the relevant limit, promptly purge the cylinder.
    3. At shutdown, purge all resin from the cylinder before turning off the cylinder heater.
    4. As purging material, use only non-colored polyethylene, transparent polystyrene, or Asaclean purging agent from Asahi Kasei; do not use any other resin. Always submerge purged resin in water immediately after purging, to prevent air contamination in the working environment.
    5. Do not mix TENAC-C with pigments or additives other than those designated by Asahi Kasei, or with different resins or resin grades, as this may degrade the thermal stability of TENAC-C and lead to decomposition.
    6. Ensure that the cylinder, nozzle, hot runners, and other high temperature zones are free from local resin detention, as this may result in resin burning or decomposition. In the event of such detention, promptly remove all residual resin by complete, thorough purging.
    7. Always provide adequate local or general ventilation to maintain a safe working environment.
  5. The information provided here is accurate to the best of our knowledge, based on all information and data available at this time, and is subject to change without notice. It is provided with no guarantee or assumption of liability whatsoever. It applies only to the normal handling and use of TENAC-C as a molding material. Any other use or application would necessitate additional, special safety precautions, and is not recommended.

TENAC™

Asahi Kasei started the production and sales of TENAC™ homopolymers in 1972, followed by copolymers in 1985, and the world-first polyacetal block copolymers TENAC™ LA series in 1987.
The company started production and sales of copolymers in Zhangjiagang, China since 2004 in addition to the plant in Japan.
In the polyacetal business field, Asahi Kasei is the world's only manufacturer of both homopolymers (TENAC™) and copolymers (TENAC™ -C), as well as for the block copolymers "TENAC™ LA series" with its own unique technologies.

LEONA™

The Asahi Kasei LEONA™ grades are molding compounds based on PA66, PA612 and semi-aromatic polyamides such as PA66/6I. The range is available in unfilled grades as well as reinforced with glass fibers and special composites. LEONA™ is noted for its high strength, heat, oil, and abrasion resistance as well as for its processability.

Asahi kasei has long experience on the polyamide market since 1972, and is fully able to produce PA66 completely from monomer to compound. Our compounding technologies allow for global quality with local production.

XYRON™

Asahi Kasei started the production and sales of XYRON™ in March 1979. XYRON™ consists of various portfolio that enables the selection of various PPE alloy combinations with other resins such as polystyrene (PS), polyamide (PA), polypropylene (PP), polyphenylene sulfide (PPS) .

TENAC™

Asahi Kasei started the production and sales of TENAC™ homopolymers in 1972, followed by copolymers in 1985, and the world-first polyacetal block copolymers TENAC™ LA series in 1987.
The company started production and sales of copolymers in Zhangjiagang, China since 2004 in addition to the plant in Japan.
In the polyacetal business field, Asahi Kasei is the world's only manufacturer of both homopolymers (TENAC™) and copolymers (TENAC™ -C), as well as for the block copolymers "TENAC™ LA series" with its own unique technologies.

LEONA™

The Asahi Kasei LEONA™ grades are molding compounds based on PA66, PA612 and semi-aromatic polyamides such as PA66/6I. The range is available in unfilled grades as well as reinforced with glass fibers and special composites. LEONA™ is noted for its high strength, heat, oil, and abrasion resistance as well as for its processability.

Asahi kasei has long experience on the polyamide market since 1972, and is fully able to produce PA66 completely from monomer to compound. Our compounding technologies allow for global quality with local production.

XYRON™

Asahi Kasei started the production and sales of XYRON™ in March 1979. XYRON™ consists of various portfolio that enables the selection of various PPE alloy combinations with other resins such as polystyrene (PS), polyamide (PA), polypropylene (PP), polyphenylene sulfide (PPS) .