Molding conditions

■ Homopolymer

Category Homopolymer
Grades

2010,3010,4010,4012,4050,4060,5010,5050,7010,7050,7054,9054,2013A,3013A,4013A,5013A,FS410,GA510,GA520, GN705,LA543,LL700,LM511,LP402,LS701,LT200,LT802,LT804,MG210,Z3010,Z4060

Predrying Conditions Temp.(°C) 80~90
Time (hr) 3~4
Molding Conditions Resin Temp. (°C) 190~210
Mold Temp. (°C) > 60
Note

TENAC™ molding conditions

  1. Before handling or using any TENAC™ polyacetal resin, be sure to consult the relevant Material Safety Data Sheet (SDS), available Asahi Kasei Corporation. Polyacetal resins generate gases, principally formaldehyde, during decomposition.
  2. Keep away from flame and heat sources. During a fire, irritating and highly toxic gases (formaldehyde, carbon monoxide, etc.) may be generated by thermal decomposition or combustion.
  3. If resin is spilled on the floor, clean it up immediately to prevent slipping and falling.
  4. Their decomposition in the cylinder of the molding, extruding, or other processing machine may also cause a dangerous high-pressure buildup inside the cylinder. When handling or processing TENAC™, the following precautions must be observed.

    1. Avoid resin temperatures and cylinder residence times which may cause resin decomposition. The following limits are a general guide; temperature and residence time may be lower for specific operating conditions.

      – Resin temperature

      Optimum: 190 – 210°C
      Maximum: 230°C
      – Maximum cylinder residence time
      For non-reinforced non-colored resins:
      50 min. at 190°C
      40 min. at 200 °C
      30 min. at 210 °C
      For colored or reinforced resins, consult Asahi Kasei Corporation.
      (上記は一応の目安であるが諸条件により異なるものである。)

    2. In any case where the cylinder residence time exceeds the relevant limit, promptly purge the cylinder.
    3. At shutdown, purge all resin from the cylinder before turning off the cylinder heater.
    4. As purging material, use only non-colored polyethylene, transparent polystyrene, or Asaclean purging agent from Asahi Kasei; do not use any other resin. 
      Always submerge purged resin in water immediately after purging, to prevent air contamination in the working environment.
    5. Do not mix TENAC™ with pigments or additives other than those designated by Asahi Kasei, or with different resins or resin grades, as this may degrade the thermal stability of TENAC™ and lead to decomposition.
    6. Ensure that the cylinder, nozzle, hot runners, and other high temperature zones are free from local resin detention, as this may result in resin burning or decomposition. In the event of such detention, promptly remove all residual resin by complete, thorough purging.
    7. Always provide adequate local or general ventilation to maintain a safe working environment.
  5. The information provided here is accurate to the best of our knowledge, based on all information and data available at this time, and is subject to change without notice. It is provided with no guarantee or assumption of liability whatsoever. It applies only to the normal handling and use of TENAC™ as a molding material. Any other use or application would necessitate additional, special safety precautions, and is not recommended.

 

■ Copolymer

Category Copolymer
Grades 3510,3513,4513,4520,4563,5520,7513,7520,8520,9520,FF520,CF452,CF454,EF750,EF850,GN455,GN752,GN755,HC350,HC450, HC460,HC550,HC750,HC760,LD755,LT350,LV450,LX750,LZ750,MT754,NS556,TFC64,TFC77,TFC84,Z3510,Z3513,Z4513, Z4520,Z4563,ZH450,ZH760,ZLV40,ZM413
Predrying Conditions Temp.(°C) 80~90
Time (hr) 3~4
Molding Conditions Resin Temp. (°C) 180~210
Mold Temp. (°C) > 60
Note

TENAC™-C molding conditions

  1. Before handling or using any TENAC™-C polyacetal resin, be sure to consult the relevant Material Safety Data Sheet (SDS), available Asahi Kasei Corporation. Polyacetal resins generate gases, principally formaldehyde, during decomposition.
  2. Keep away from flame and heat sources. During a fire, irritating and highly toxic gases (formaldehyde, carbon monoxide, etc.) may be generated by thermal decomposition or combustion.
  3. If resin is spilled on the floor, clean it up immediately to prevent slipping and falling.
  4. Their decomposition in the cylinder of the molding, extruding, or other processing machine may also cause a dangerous high-pressure buildup inside the cylinder. When handling or processing TENAC™-C, the following precautions must be observed.

    1. Avoid resin temperatures and cylinder residence times which may cause resin decomposition. The following limits are a general guide; temperature and residence time may be lower for specific operating conditions.

      – Resin temperature

      Optimum: 180 – 210°C
      Maximum: 250°C
      – Maximum cylinder residence time
      For non-reinforced non-colored resins:
      70 min. at 190°C
      60 min. at 200°C
      40 min. at 210°C
      For colored or reinforced resins, consult Asahi Kasei Corporation.
      (上記は一応の目安であるが諸条件により異なるものである。)

    2. In any case where the cylinder residence time exceeds the relevant limit, promptly purge the cylinder.
    3. At shutdown, purge all resin from the cylinder before turning off the cylinder heater.
    4. As purging material, use only non-colored polyethylene, transparent polystyrene, or Asaclean purging agent from Asahi Kasei; do not use any other resin. 
      Always submerge purged resin in water immediately after purging, to prevent air contamination in the working environment.
    5. Do not mix TENAC™-C with pigments or additives other than those designated by Asahi Kasei, or with different resins or resin grades, as this may degrade the thermal stability of TENAC™-C and lead to decomposition.
    6. Ensure that the cylinder, nozzle, hot runners, and other high temperature zones are free from local resin detention, as this may result in resin burning or decomposition. In the event of such detention, promptly remove all residual resin by complete, thorough purging.
    7. Always provide adequate local or general ventilation to maintain a safe working environment.
  5. The information provided here is accurate to the best of our knowledge, based on all information and data available at this time, and is subject to change without notice. It is provided with no guarantee or assumption of liability whatsoever. It applies only to the normal handling and use of TENAC™-C as a molding material. Any other use or application would necessitate additional, special safety precautions, and is not recommended.

Please contact us to ask any questions, discuss any concerns, and request samples.

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