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Electrical and electronic
Ion migration

Ion migration inhibiting plastics for electric and electronic component applications

What is ion migration?

There are two types of migration, electromigration and ion migration (electrochemical migration), and this page covers information on the latter, which occurs due to external factors.

Ion migration occurs when there is poor insulation between electrodes due to factors such as chemicals or heat, causing elution of the electrode metal and a subsequent short circuit.

To support our customers’ initiatives in making products used in electric and electronic applications, we offer a variety of engineering plastics that inhibit ion migration, haveare flame retardancet, and are superior in terms of various electrical properties (tracking resistance (CTI), etc.), glow wire ignition temperature (GWIT, etc.), long-term heat resistance (UL 746B RTI, etc.), and weather resistance, (UL 746C f1, f2). 
For example, using a material that does not result in ion migration suppresses short circuits between terminals, contributing to improved product safety, and smaller, more compact product designs.

Red phosphorus-free flame Flame retardance Materials that suppresses ion migration LEONA™ XYRON™ Flame retardance grade

Asahi Kasei offers a range of products that are suitable for use in electric and electronic applications including flame retardant resin materials such as LEONA™ and XYRON™ , which eliminate ion migration triggered by flame retardants or slow progression compared to products that use red phosphorous.

Ion migration resistance evaluation methods

This section covers testing methods for evaluating the ion migration resistance of resin materials.  

As shown in Figure 1, copper electrodes are affixed to plates of various resin materials and high voltage is applied under high temperature and high humidity conditions.

Ion migration resistance evaluation schematic drawing
Figure 1: Ion migration resistance evaluation schematic drawing

Ion migration occurs in the following way in this test:

1: The flame retardant breaks down under high temperature, high humidity conditions, forming corrosive substances
2: Copper electrodes dissolve, generating copper ions
3: Copper ions receive an electron and are deposited as a metal
4: Steps 1 to 3 above are repeated, and the deposited copper is gradually extended to the other electrode

After exposure to the above testing conditions for a certain period of time, the copper distributed across the electrodes was researched using elemental analysis. When ion migration occurs, the copper element is gradually extended from one electrode to the other as shown in Figure 2.

 The copper element distribution
Figure 2: The copper element distribution

Ion migration resistance evaluation results

The evaluation results for the product using red phosphorus and the XYRON™ flame retardant series are shown in Figure 3.
There is no ion migration in the  XYRON™ flame retardant series, confirming the excellent results compared to the general product made using red phosphorus.

 Ion migration resistance evaluation results for the general product made using red phosphorus and XYRON™
Figure 3: Ion migration resistance evaluation results for the general product made using red phosphorus and XYRON™

 

Next, the evaluation results for the LEONA™ flame retardant series are shown in Figure 4.

It was confirmed that there is no ion migration with the FR370. Although ion migration was confirmed to have occurred in the SN11B, the extension of copper was less than half that of the general product made using red phosphorus, confirming its slow progres

Ion migration resistance evaluation results for the general product made using red phosphorus and LEONA™
Figure 4: Ion migration resistance evaluation results for the general product made using red phosphorus and LEONA™

 

The above evaluation results confirm that Asahi Kasei’s LEONA™ and XYRON™ flame retardant series are resistant to ion migration. And because progression is slowed compared to products using red phosphorous, these materials are suitable for use in electric and electronic applications.

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