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LEONA™ Halogen-Free Polyamide with High CTI and Long-Term Heat Resistance (Under Development)

2026.05.15

LEONA™
Development Grade

Technologies and Products

As electrical components continue to move toward higher voltages and increased miniaturization, resin materials are increasingly required to achieve both long-term heat resistance and electrical reliability.

In general, halogen-based heat stabilizers are often used to ensure the long-term heat resistance and thermal stability of polyamides. However, such additives can pose challenges from the perspectives of tracking resistance and ion migration risk.

This LEONA™ development grade achieves both long-term heat resistance and high CTI without the use of 
halogen-based heat stabilizers.
With excellent aging resistance and ion migration resistance, it contributes
 to improved electrical reliability and enhanced long-term safety in electrical and electronic applications.

Key Features

  • No halogen-based heat stabilizers
  • Combination of heat aging resistance and tracking resistance (CTI > 600 V)
  • Material design that does not adversely affect electronic control components (Electrical friendly)

①    Heat Aging Resistance

This development grade of LEONA™ demonstrates excellent heat aging resistance despite being halogen-free.
In general, halogen-based heat stabilizers are often considered to ensure long-term heat resistance in polyamides; however, such additives can involve trade-offs in terms of electrical properties and reliability.

Grade LEONA™
Development Grade
LEONA™ 1300G
(Conventional)
LEONA™ 14G35
(Conventional)
Feature Heat-resistant & high CTI Heat stabilizer added Halogen-based stabilizer
Composition PA66+GF35% PA66+GF33% PA66+GF35%
Long-term heat resistance
3000hr hot-air aging
Tensile stress retention
120℃ (++ = >85%) ++ + ++
150℃ (++ = >70%) ++ + ++
Tracking resistance
[CTI]
(IEC)
Material Group I I II
CTI Value 600V 600V 500V
Ion migration Not observed Not observed Observed
Metal Corrosion Resistance Good Good Corrosion
Low ion leachability Good Good Leaching

 

Comparison of Key Properties of LEONA™ Development Grades

 

By optimizing the material formulation, this grade has been confirmed to maintain high tensile strength even after 3,000 hours of high-temperature aging.
This suppression of property degradation under long-term use conditions enables a strong balance between thermal stability and long-term reliability, both of which are critical requirements for electrical and electronic components.

②    Ion Migration Resistance

Under high-voltage conditions, halogen ions can cause metal ion dissolution and migration at electrodes (ion migration), increasing the risk of short circuits and failures.
In particular, it is well known that halogen-containing materials are more prone to metal ion deposition and dendrite formation.

What is ion migration? (Click here for details)

For this development grade, evaluations conducted under severe conditions (85°C / 85% RH / 800 V / 500 hours) confirmed no occurrence of ion migration.

Ion Migration Evaluation Results

Ion Migration Evaluation ResultsIon Migration Evaluation Results

No deposits were observed between electrodes. As a result, this material contributes as an electrically safe and reliable (“Electrical friendly”) solution for electrical applications used in high-voltage environments.

* “Halogen-free” on this page indicates that iodine (I), bromine (Br), and chlorine (Cl) are not intentionally added.

This development grade represents a new LEONA™ solution that successfully balances long-term heat resistance, high CTI, and ion migration resistance within the constraints of a halogen-free design.
In electrical applications where higher voltages and longer service life are increasingly required, it helps reduce material-related electrical failure risks while improving both design flexibility and overall reliability.

For feasibility studies, detailed evaluation data, or potential applications, please feel free to contact us.

If you would like more information, please contact us using the form below.

Inquiry

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